Broadcom Launches Open NFV Platform and Multiple SoCs

broadcom-SoC

At the Mobile World Congress, Broadcom has announced a new single-chip millimeter wave (MMW) system on a chip (SoC) to support mobile broadband services. (Image: Broadcom)

Gearing up to showcase a number of new technologies and innovation at Mobile World Congress next week in Barcelona, Broadcom announced a new Open Network Function Virtualization platform, a global location chip for wearables, and a single-chip millimeter wave system on a chip capable of 10 Gbps.

Hoping to accelerate Open Network Function Virtualization (NFV)  adoption by allowing implementation of applications across multiple system-on-chip (SoC) processors solutions, Broadcom announced its Open NFV platform.  Using the platform OEMs and ecosystem vendors can easily migrate virtual functions (VF) between platforms based on various vendor solutions. Broadcom will showcase the innovations at Mobile World Congress in Barcelona next week, and a proof of concept demonstrating a live VF state migration between multiple Instruction Set Architectures (ISA) has been approved by the European Telecommunications Standards Institute (ETSI) NFV Industry Specification Group.

The basis of Broadcom's Open NFV platform is open source components such as Linux, KVM and OVS giving customers a consistent platform independent of the target SoC's ISA, thus allowing vendors to develop NFV applications that are highly portable. In partnership with ARM, Broadcom is working to enable equipment manufacturers designing NFV solutions to meet next-generation carrier-class requirements utilizing open standards that enhance code portability and reduce development time.

"Customers have been asking for an ISA-independent solution to migrate virtual functions across diverse platforms, something they didn't previously have," said Ron Jankov, Broadcom Senior Vice president and General Manager, Processors and Wireless Infrastructure. "Broadcom's partnership with ARM and other third party vendors helps advance our NFV goals and meet the workload flexibility and scalability needs of our customers, while maintaining our commitment to a truly open ecosystem."

Global Location chip for Wearables

Broadcom introduced a Global Navigation Satellite System (GNSS) system-on-chip (SoC), designed for low-power, mass-market wearable devices such as fitness trackers and smart watches.  Targeting a growing wearables market the new BCM4771 GNSS SoC with on-chip sensor hub enables consumers to more accurately track and manage their health and wellbeing by delivering precision activity tracking and location data while consuming less power than traditional architectures.  It significantly reduces power consumption and board area by combining its location capabilities with an integrated sensor hub, contextual awareness, and GNSS. Using a 40 nanometer process technology the chip includes a sensor hub that integrates sensor inputs for its on-chip algorithms to detect the user's context, accurately compute speed and distance traveled, and provide fitness applications with the GNSS track.

"Today's wearables like fitness trackers have surged in popularity, but often miscalculate speed and distance," said Mohamed Awad, Broadcom Director, Marketing, Mobile and Wireless Group. "As the largest supplier of discrete GNSS solutions, Broadcom brings its location expertise to deliver more precise fitness and health measurements to the accelerating wearable market."

Broadcom announces 10Gbps Millimeter Wave SoC

Broadcom announced a new single-chip millimeter wave (MMW) system on a chip (SoC) optimized for wireless backhaul and fronthaul applications. For carriers looking for cost-effective and flexible products to meet the growing bandwidth demands of mobile broadband services, the BCM85100 offers a scalable option and up to 10 Gigabits per second (Gbps) of capacity. The BCM85100 SoC enables easy capacity upgrades by software, and it offers the entire range from Mbps to 10 Gbps over single antenna, single channel and single polarization, providing carriers and telecomm equipment manufacturers with a unified millimeter wave solution.

"The growing demand of data services and connected devices are all driving mobile backhaul networks to new heights of capacity, resulting in the need for more cell site connections," said Richard Webb, Infonetics Research Directing Analyst of Microwave and Carrier Wi-Fi . "The millimeter wave solution represents the next step in addressing these capacity needs and is proving to be a viable solution for backhaul in metro areas where range limitations aren't always problematic. Reaching 10 Gbps is a major milestone for the industry and raises the bar as an integrated SoC that will further drive the millimeter wave market."